Senior Scientist - Advanced Packaging Program - Science Park
Agency for Science, Technology and Research (A*STAR)
Senior
Not specified
SG
Posted 1 day ago
Job summary
Join A*STAR's Advanced Packaging Program as a Senior Scientist driving innovation in chip-to-wafer and wafer-to-wafer bonding technologies. Lead groundbreaking projects and improve advanced packaging processes for cutting-edge applications in AI and High-Performance Computing. Collaborate with a team of experts while engaging with industry stakeholders and developing new solutions in semiconductor technologies. Apply now to further your career in a dynamic research environment!
Role details
- Role
- Full-time
- Industry
- Engineering And Architecture
- Employment
- Fulltime
- Experience
- 5 Years +
- Education
- PhD In Materials Science And Engineering
Responsibilities
- Conceptualise and lead capability development
- Lead multi-disciplinary project teams
- Engage and manage stakeholders for R&D
- Conduct research on bonding techniques
- Investigate wafer bonding processes
- Optimize die-bonding processes
- Conduct engineering experiments
- Act as a subject matter expert
- Collaborate with senior staff and partners
- Inspire and mentor talents in semiconductor technology
Requirements
- 5 to 10 years of experience in device fabrication
- management experience with industry partners
- hands-on experience in BEOL wiring processes
- experience in C2W/W2W fusion/hybrid bonding
- experience in flip-chip bonding
Key skills
Chip Stacking
Bonding Techniques
Project Management
Process Integration
Data Analysis
Reliability Characterization
Analytical Skills
Problem-solving Skills
Communication Skills
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- Advanced Packaging Program at the Institute of Microelectronics (IME) is seeking a passionate and skilled Scientist or Senior Scientist to join our team. The candidate will be responsible to advance the state\-of\-the\-art chip\-to\-wafer and wafer\-to\-wafer fusion/hybrid bonding capabilities, develop 2\.5D interposer and 3D chip stacking process integration flows for Heterogenous Integration of chiplets for Artificial Intelligence and High\-Performance Computing applications, and conducting electrical, thermal and mechanical reliability characterization. The position provides an exciting opportunity to contribute to groundbreaking technologies and collaborate with a dynamic team of researchers and external stakeholders.
Key Responsibilities
Conceptualise and lead internal capability development and external industry projects involving new materials, advanced process integration approaches, and innovative concepts.
Lead multi\-disciplinary project team for the execution of industry projects with manageable risks and mentor less experienced colleagues.
Engage and manage internal and external stakeholders for the R\&D projects execution and provide timely updates for timely deliverable.
Conduct research and develop advanced fine\-pitch flip\-chip \& hybrid bonding techniques for chip\-to\-wafer, emphasizing bonding parameter optimization and process enhancements.
Investigate and refine wafer bonding processes for interposer fabrication, inter\-dielectric gap fill, and alignment accuracy, addressing critical factors such as warpage, bonding strength, and yield.
Optimize die\-bonding processes, including the selection of low\-temperature organic and inorganic bonding materials, surface preparation, bonding materials and bonding methods.
Conduct engineering experiments for process characterization to drive quality and yield improvements.
Act as a subject matter expert (SME) for both internal and external stakeholders, providing guidance and expertise.
Collaborate with senior staff, process integrators, and external partners to address technology roadmap and process capabilities development.
Inspire and mentor talents in semiconductor technology, contributing to workforce development in the field.
JOB REQUIREMENT/Qualifications
PhD in Materials Science and Engineering, Mechanical or Chemical Engineering, Electronics, Electrical and Computer Engineering, or a related field.
5 to 10 years of experience in device fabrication, back\-end\-of\-line (BEOL) and advanced packaging processes \& integration required for 2\.5D/3D heterogeneous integration applications. Project and stakeholder (including industry partners) management experience will be added advantage. Hands\-on experience in BEOL wiring processes \& integration, C2W/W2W fusion/hybrid bonding and flip\-chip bonding are required.
Strong knowledge in advanced packaging technologies in particular hybrid bonding equipment, bonding materials, processes \& integration, and reliability characterization are preferable.
Strong analytical and problem\-solving skills. Proficiency in data analysis and interpretation and design of experiments. Proven ability to troubleshoot and resolve process\-related challenges. Excellent written and verbal communication abilities.
Ability to work collaboratively in a research\-oriented environment (OEMs, customers, and Internal stakeholders). Demonstrated ability to manage multiple tasks and projects simultaneously.
The above eligibility criteria are not exhaustive. A\*STAR may include additional selection criteria based on its prevailing recruitment policies. These policies may be amended from time to time without notice. We regret that only shortlisted candidates will be notified.
Type of Employment : Full\-Time
Minimum Experience : 5 Years
Work Location : Science Park